Design and fabrication of silicon hybrid multi-chip modulesTRIGG, A. D.GEC journal of research. 1989, Vol 7, Num 1, pp 16-27, issn 0264-9187, 12 p.Article

Cross-sectional characterization of semiconductor device structures using scanning electron microscopyPATEL, J; TRIGG, A. D.GEC journal of research. 1984, Vol 2, Num 4, pp 240-246, issn 0264-9187Article

CANVAS: an intelligent system for colour selection on CRT displaysGILL, G. A; TRIGG, A. D.International journal of remote sensing (Print). 1988, Vol 9, Num 9, pp 1423-1432, issn 0143-1161Article

CANVAS, an intelligent system for colour selection on CRT displaysGILL, G. H; TRIGG, A. D.International journal of remote sensing (Print). 1988, Vol 9, Num 9, pp 1423-1432, issn 0143-1161Article

SEM techniques for the study of interfaces in semiconductorsRICHARDS, B. P; TRIGG, A. D.GEC journal of research. 1985, Vol 3, Num 3, pp 167-180, issn 0264-9187Article

Temperature mapping of ICs and MEMS devices using an infrared microscopeTRIGG, A. D.THERMINIC 2000. International workshopBudapest University of Technology and Economics. 2000, pp 40-45, isbn 2-913329-51-9Conference Paper

Surface analysis techniques and their application to materials and device characterizationHARRIS, P. G; TRIGG, A. D.GEC journal of research. 1987, Vol 5, Num 2, pp 88-98, issn 0264-9187Article

Modular sensor chip design for package stress evaluation and reliability characterisationTRIGG, A. D; CHAI TAI CHONG; ZHANG XIAOWU et al.Microelectronics and reliability. 2012, Vol 52, Num 8, pp 1581-1585, issn 0026-2714, 5 p.Conference Paper

Influence of Si nanocrystal distributed in the gate oxide on the MOS capacitanceNG, C. Y; CHEN, T. P; FUNG, S et al.I.E.E.E. transactions on electron devices. 2006, Vol 53, Num 4, pp 730-736, issn 0018-9383, 7 p.Article

Work function tuning of metal nitride electrodes for advanced CMOS devicesREN, C; FAIZHAL, B. B; CHAN, D. S. H et al.Thin solid films. 2006, Vol 504, Num 1-2, pp 174-177, issn 0040-6090, 4 p.Conference Paper

Fault isolation and failure analysis techniques for high density packagingTRIGG, A. D.International Symposium on the Physical & Failure Analysis of Integrated Circuits. 2004, pp 93-98, isbn 0-7803-8454-7, 1Vol, 6 p.Conference Paper

A dual-strained CMOS structure through simultaneous formation of relaxed and compressive strained-SiGe-on-insulatorBERA, L. K; MUKHERJEE-ROY, M; LO, G. Q et al.IEEE electron device letters. 2006, Vol 27, Num 5, pp 350-353, issn 0741-3106, 4 p.Article